Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. com. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. You previously purchased this product. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). View eCAD Files. 6 XCede RAM and Extended RAM 2 Pair Application Tools 694-4528-000 – 2-Pair RAM Loading Head 1. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThe XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. - FCI. Integrated guidance, keying and polarizing side walls available. These connectors are two-piece devices that connect two printed circuit boards. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. 6. XCede ® HD is a small form factor system with a modular design for significant space savings and. PDF 957-4100-AXX 4 PAIR POWER. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. FCI. Additionally, there will be an electro-static. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. 2. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. 5 out of 5 stars 3,424. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in. XCede® connectors also address. Complementary guide and power modules are also included in the product range. Login or REGISTER Hello, {0}. 85 Ω and 100 Ω options. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. The XCede HD connector. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. EN. Rugged Edge Rate® contact system. See Figure 15 for details. For a 6-pair differential connector per column, 82. element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 2. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators. XCede® connectors also address. 4 differential signal pairs per inch are provided corresponding to a minimum slot spacing of 36 mm. distance curve will begin to further increase in slope. Login or REGISTER Hello, {0}. Skip to Main Content (800) 346-6873. Click OK to extend your time for an additional 30 minutes. 2. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall XCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. DETAILS. XCede® connectors also address. 4. Ruggedized design for high reliability and ease of application. PCIe Gen. Three levels of sequencing enable hot plugging. Features. Electrical & Mechanical Models. Amphenol Communications Solutions XCede high-performance backplane connector system. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office! 🤝🏙️ Excellent insights were shared by our distinguished speakers: 🌟 🎙️ Jon Howard from the BBC 🎙️ Chris Soulier from Cinch 🎙️ Gemma Turner from The Very. 00mm pitch (FF5026) and 050mm pitch (FF3025). 08mm. Выбрать и купить Board-to-board connector / right-angle - XCede® RAM Amphenol вы можете у наших менеджеров, позвонив по телефону в Санкт-Петербурге 645-08-06. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. Amphenol is one of the leading manufacturers of Backplane connectors. 80 mm High-Density Backplane Right-Angle Receptacle. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. This was soon replaced by DIMM with a 64-bit data path. 1. Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability. Revision SCR No. Basics is present with its full range of products to meet the needs of our customers. Integrated power, guidance, keying and side walls available. DDR-SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors. Contact Mouser (USA) (800) 346-6873 | Feedback. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Skip to Main Content (800) 346-6873. xcede hd backplane assembly 4 pair connector, leadfree part no. Login or REGISTER Hello, {0}. XCEDE® BACKPLANE CONNECTOR SYSTEM XCEDE® POWER SYSTEM 150 grams normal force nominal POWER RATING Modular construction gives an effective current density of 8. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. XCede® connectors also address. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. Revision SCR No. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). 7. XCede ® HD and XCede ® HD Plus, this connector provides . XCede® HIGHdPERFORMANCE BACKPLANE CONNECTOR. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. The XCede ® HD Plus backplane connector achieves high . Login or REGISTER Hello, {0}. 2. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. For XCede HD RAM and XCede HD Inverted RAM refer to this documents. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design. 2. See Appendix "A" for the seating press recommendations and process recommendations. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. Role: Data Engineer Salary: up to €95k (DOE) + Benefits Remote Working Policy: Fully remote available Location: Mainz (fully remote) Tech Stack: Spark/Hadoop, Data Lake, AWS/Azure, Python, Kafka, Airflow, Docker, CI/CD. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 7. XCede. Features. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 7. 0 - 30. Yelp is a fun and easy way to find, recommend and talk about what’s great and not so great in Victoria and beyond. See Appendix “A” for the seating press recommendations and process recommendations. Male SMA connectors have a center pin and inner threads whereas female SMA connectors have. DC Connector Configurations. Distance Curve of MEP-12T press for XCede and XCede Plus connectors. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). 99. challenging architectures. DETAILS. Vertical or Right Angle. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Guidance and keying options. Page 174 Figure 127. Random Access Memory, or RAM (pronounced as ramm ), is the physical hardware inside a computer that temporarily stores data, serving as the computer's "working" memory. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. They're small enough for most consumer RF applications and they use a threaded housing to create strong mechanical connections. Upload your CV. 1. 4, 6 or 8 columns. 4-, 5-, 6-, 8-pair configurations. XCede® connectors also address. ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。. 2. Submit a Brief. Sign Up or Register. 8 mm column pitch representing a 35% increase versus XCede®. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 08mm. XCede® connectors also address. 2 617-0450-014 xcede hd 4pair stiffener 1 1 922-421f-d3h xcede hd 4pair lc mod w/ organizer, 8pos, 100ohms, bifurcated, . XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in mind. Description Initial Date “A” S2401 Initial Release E. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Mechanical longevity and ruggedness. 12 - 48 pairs. 00mm: 2 - 54: 1. Click to download Certificate of. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Dislaime Please note that the above information is subect to change without notice. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. Founded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Here's a hint for each of the word groups in today's Connections puzzle, plus a couple more clues to help you find the answer:. 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Spacone 5-29-12 The XCede® Right-Angle Male (XCede® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution by creating traditional. 6. See section 4 regarding XHD2 RAM connectors. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThis document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). Samtec XCede® HD HPTS 3. 3. XCede connectors also meet higher linear signal density requirements at backplane or midplane interfaces. DC Connector Configurations. 4、6或8列. Amphenol is one of the leading manufacturers of Backplane connectors. 54 - 5. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. XCede High Speed / Modular Connectors are available at Mouser Electronics. Available in straddle mount, through-hole termination and also SMT. 4 - Four (4) Onboardports by default . The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. High-density backplane system – up to 84 differential pairs per linear inch. XCede® connectors also address. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card connector or. 4. high speed performance, paddle card edge connector series for next Gen. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. 提供集成式导引、锁合以及顶针侧壁. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Contact us today for more details of XCede HD, part number 970301YD2B. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. 1. XCede® connectors also address. Contact Mouser (USA) (800) 346-6873 | Feedback. 1. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingBuy XCede HD2 Series Backplane Connectors. This document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). English. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card. Dislaime Please note that the above information is subject to change without notice. Discover More. Manufacturer of Connector and Connector Systems. Out of these, the cookies that are categorized as necessary are stored on your browserGermany. Login or REGISTER Hello, {0}. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. for connector repairability. The XCede ® HD Plus backplane connector achieves high . 2-, 3-, 4-, 5-, 6-Pair configurations. 三个等级的上电次序实现了热插拔. Integrated power and guidance. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. GR-1217-CORE-Generic Requirements for Separable Electrical Connectors used in Telecommunications. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. use keep out zone. Shear Stud Connectors. Memory card connector / PCI. 1. Brand of Product：Amphenol ICC,Part#：946-230X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. Part # dimensions for each XCede connector type. XCede® Stacker. 7mil Drill Minimum Pad Size vs. 2. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. 1. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine,. EN. jx410-51594 rev drawing no. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. 1. 63. We offer interconnection systems from 2. XCede. 80 mm高密度背板垂直插头. Revision “F” Specification Revision Status . Brand of Product：Amphenol ICC,Part#：946-200X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. 65; 29 In Stock; New Product; Mfr. 2-, 3-, 4-, 5-, 6-Pair configurations. XCEDE CONNECTOR ECCN / UNSPSC / COO. 1 DOCUMENTS 2. 2. 1. 1. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. BENEFITS. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Basically, it is how all major components inside a computer talk with each other. 0 DEFINITIONS 4. TARGET MARKETS. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. challenging architectures. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. Amphenol Communications Solutions. Subscribe news. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Login or REGISTER Hello, {0}. SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. 062") thick cards. XCede Product Family Connector Press-fit Installation Process . XCede® connectors also address. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. The. XCede® HD 1. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. 40G QSFP+ to QSFP+ DAC Cable. RAM Steel Beam Design calculates the number of studs required, accounting for the locations of maximum moments and zero moments and special distributions required due to the presence of point loads. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick WallXCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. REPAIR PROCEDURE FOR MODULE SEE TB-2217. 1. 1. 4. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Advanced Search. by Xcede. This card can be used in an ITX system with an M. XCede® connectors also address. Buy XCede HD Series Backplane Connectors. Amphenol Xcede Series High Speed / Modular Connectors are available at Mouser Electronics. Available with 40, 60 and 80 signal pins. 5. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® HD是一个采用. § Differential pairs 28-84 per inch (11-33 differential pairs per10120130-L0J-20DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Left Wall By apogeeweb, 10120130-l0j-20dlf, 10120130-l0j-20dlf datasheet,10120130-l0j-20dlf pdf,amphenol icc (fci)Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3. 1. 1. These connectors are two-piece devices that connect two printed circuit boards. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. 7. Check Pricing. The XCede HD connector. Dislaime Please note that the above information is subect to change without notice. EBCF. Standard or high-speed wafers available. Amphenol TCS XCede® Backplane Connectors. View in Order History. English. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. Aug 25, 2011XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. XCede® connectors also address. 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Check Pricing. . Your Price. backplane to expander board connector (BP_XCEDE_2) 3. Available with 40, 60 and 80 signal pins. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 80 mm高密度背板垂直插头. Inactivity Warning Dialog. 下载3D模块 配置并加入到购物车 配置免费样品 技术参数. ExaMAX ® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. screw length and part number are dependent on daughtercard thickness (as specified from configurator). 1. Delete of interface FortyGigE1/0/49, and then exit the system mode and save the configuration. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). Features. Close Modal. 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede HD achieves the highest performance in an HM compatible form factor. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. The standard XHD2 differential interconnect platform consists of connectors featuring 3, 4, or 6 differential pairs, with an optional extra ground lead available on the A wafer. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. drwXCede ® connectors also address requirements for high linear signal density at the backplane and daughter card interface. 3、4和6对设计. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Mouser offers inventory, pricing, & datasheets for XCede Connectors. High Speed / Modular Connectors XCede HD High-Density Backplane Custom Right-Angle Module BSP-226769-01; Samtec; 1: $29. Daugtercard connectors feature Amphenol’s integral stiffener which allows designersXCede ® High-Performance Backplane Connector System. 2. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. Features. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 10120130-Y0J-20DLF Datasheets | Backplane Connectors Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Right By apogeeweb, 10120130-Y0J-20DLF, 10120130-Y0J-20DLF Datasheet,10120130-Y0J-20DLF PDF,Amphenol ICC (FCI)XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Connectors; High Speed Board-to-Board; Micro Pitch Board-to-Board; Rugged / Power; Edge Card; Backplane / Micro Backplane; Standard Board-to-Board; Industry Standards;. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. FEATURES. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The inserts can be installed as per the. High-density backplane system – up to 84 differential pairs per linear inch. Connector & Configuration Pair Size Product type Columns XCede HD Backplane 3 4 6 8 12 14 24 15 22 30 40 44 Vertical Header Signal Vertical Header Signal Vertical Header Signal Standard Enhanced Enh Gen 2 Vertical Receptacle Power R/A Header Power R/A Receptacle Guide ModuleXCede High Speed / Modular Connectors are available at Mouser Electronics. 2 mm, Receptacle, Press Fit, 2 Rows. Improves signal integrity and increases signal. 1. 2. 2 Pair. XCede Connectors are available at Mouser Electronics. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis. Login or REGISTER Hello, {0}. Free shipping on many items | Browse your favorite brands | affordable prices. Up to 82 differential pairs. 3. 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. The XHD+ DC system will offer two (2) primary guidance systems, (1) the standard guide module receptacle; and (2) the wide guide. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. Integrated guidance, keying and polarizing side walls available. EspañolDownload XCede® Right Angle Receptacle 4-pair 8 column. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 80mm Right-Angle Backplane Receptacle (HDTF) From: £2. 7. RF Connectors Valcon IPEX Type RF Samtec Bulls Eye® RF Samtec Ganged RF. 1.